Inventor

YUZAWA HIROYA

JP3 patents

Patents

3 patents

US10118246B2Nov 6, 2018

Mounting apparatus

SHINKAWA KK9 citations76

US10586781B2Mar 10, 2020

Bonding apparatus and method of estimating position of landing point of bonding tool

SHINKAWA KK3 citations69

US11367703B2Jun 21, 2022

Bonding apparatus

SHINKAWA KK0 citations45