Inventor

TSENG CHUN-I

TW2 patents

Patents

2 patents

US10219366B1Feb 26, 2019

Multilayer printed circuit board capable of reducing transmission loss of high speed signals

INVENTEC PUDONG TECH CORP6 citations66

US11474136B2Oct 18, 2022

Method for examining differential pair transmission lines

INVENTEC PUDONG TECH CORP0 citations46