Inventor

SUN ZHUOWEN

US45 patents

⚠️ This page may combine multiple inventors who share the name “SUN ZHUOWEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUN ZHUOWEN

INVENSAS CORP

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Contact arrangements for stackable microelectronic package structures with multiple ranks

Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Dies-on-package devices and methods therefor

Ultra high performance interposer

Package-on-package devices with same level WLP components and methods therefor

Package on-package devices with upper RDL of WLPS and methods therefor

Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor

Enhanced density assembly having microelectronic packages mounted at substantial angle to board

Ultra high performance interposer

Flexible I/O partition of multi-die memory solution

High-bandwidth memory application with controlled impedance loading

Circuit assemblies with multiple interposer substrates, and methods of fabrication

Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces

Package on-package devices with multiple levels and methods therefor

Wafer-level packaged components and methods therefor

TFD I/O partition for high-speed, high-density applications

Reduced load memory module using wire bonds and a plurality of rank signals

Microelectronic packages and assemblies with improved flyby signaling operation

Via structure for signal equalization

Contact arrangements for stackable microelectronic package structures

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Ultra high performance interposer

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Ultra high performance interposer

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Via structure for signal equalization

High-bandwidth memory application with controlled impedance loading

Method for reduced load memory module

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Circuit assemblies with multiple interposer substrates, and methods of fabrication

TFD I/O partition for high-speed, high-density applications

Single package dual channel memory with co-support

Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design

Single package dual channel memory with co-support

Compact microelectronic assembly having reduced spacing between controller and memory packages

BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail

INVENSAS LLC

Wire bond wires for interference shielding

Wire bond wires for interference shielding

ADEIA SEMICONDUCTOR TECH LLC

Wire bond wires for interference shielding

TYCO ELECTRONICS CORP

Planar inductor devices