Inventor · disambiguated record
Chun-Jun Zhuang
Also filed as: ZHUANG CHUN · ZHUANG CHUN-JUN
15 granted patents·24 citations·filing 2016–2023
88Inventor score
Top patents by PatentIndex Score
15 records- 0192US10593630B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Mar 17, 2020·8 cites·20 claims
- 0287US11139252B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 5, 2021·2 cites·20 claims
- 0382US10475775B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 12, 2019·4 cites·18 claims
- 0479US11605597B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 14, 2023·1 cites·17 claims
- 0578US10886223B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 5, 2021·2 cites·20 claims
- 0676US10797022B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
- 0772US12142576B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Nov 12, 2024·0 cites·16 claims
- 0870US12165982B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 10, 2024·0 cites·17 claims
- 0970US10014268B2Semiconductor chip, semiconductor device and manufacturing process for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jul 3, 2018·2 cites·18 claims
- 1068US11211319B2Device structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 28, 2021·1 cites·19 claims
- 1165US9911709B1Semiconductor device and semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 6, 2018·2 cites·19 claims
- 1259US11404380B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 2, 2022·0 cites·20 claims
- 1349US11257788B2Semiconductor device package with stacked die having traces on lateral surfaceADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 22, 2022·0 cites·21 claims
- 1445US11712859B2Light-weight flexible high-thermal-conductivity nano-carbon composite film and method for preparing sameSHANGHAI COMPOSITES SCIENCE & TECH CO LTD·Filed 2017·Granted Aug 1, 2023·0 cites·9 claims
- 1539US10797019B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 6, 2020·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →