Inventor
BAE TAEYONG
US6 patents
Patents
6 patentsUS12243820B2Mar 4, 2025
Semiconductor device with fine metal lines for BEOL structure and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US12218054B2Feb 4, 2025
Method of forming an integrated circuit device having an etch-stop layer between metal wires
SAMSUNG ELECTRONICS CO LTD0 citations58
US11990409B2May 21, 2024
Semiconductor device with fine metal lines for BEOL structure and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations58
US11450608B2Sep 20, 2022
Integrated circuit devices including metal wires having etch stop layers on sidewalls thereof
SAMSUNG ELECTRONICS CO LTD0 citations58
US12014951B2Jun 18, 2024
Semi-damascene structure with dielectric hardmask layer
SAMSUNG ELECTRONICS CO LTD0 citations57
US11488864B2Nov 1, 2022
Self-aligned supervia and metal direct etching process to manufacture self-aligned supervia
SAMSUNG ELECTRONICS CO LTD0 citations47