Inventor
HAGA KOUJI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “HAGA KOUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
6 patentsUS7838482B2Nov 23, 2010
CMP polishing compound and polishing method
HITACHI CHEMICAL CO LTD15 citations91
US7837800B2Nov 23, 2010
CMP polishing slurry and polishing method
HITACHI CHEMICAL CO LTD10 citations83
US8002860B2Aug 23, 2011
CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
HITACHI CHEMICAL CO LTD12 citations81
US7410409B1Aug 12, 2008
Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound
HITACHI CHEMICAL CO LTD9 citations81
US7311855B2Dec 25, 2007
Polishing slurry for chemical mechanical polishing and method for polishing substrate
HITACHI CHEMICAL CO LTD7 citations72
US10037894B2Jul 31, 2018
Polishing liquid for metal and polishing method
HITACHI CHEMICAL CO LTD1 citations45
HAGA KOUJI
3 patentsUS8501625B2Aug 6, 2013
Polishing liquid for metal film and polishing method
HAGA KOUJI4 citations60
US8734204B2May 27, 2014
Polishing solution for metal films and polishing method using the same
HAGA KOUJI1 citations49
US8231735B2Jul 31, 2012
Polishing slurry for chemical mechanical polishing and method for polishing substrate
HAGA KOUJI1 citations48
FUKASAWA MASATO
3 patentsUS8168541B2May 1, 2012
CMP polishing slurry and polishing method
FUKASAWA MASATO2 citations60
US9293344B2Mar 22, 2016
Cmp polishing slurry and method of polishing substrate
FUKASAWA MASATO2 citations59
US8900335B2Dec 2, 2014
CMP polishing slurry and method of polishing substrate
FUKASAWA MASATO0 citations39