Inventor

CANAPERI DONALD F

US50 patents

⚠️ This page may combine multiple inventors who share the name “CANAPERI DONALD F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CANAPERI DONALD F

IBM

Very low effective dielectric constant interconnect structures and methods for fabricating the same

Very low effective dielectric constant interconnect Structures and methods for fabricating the same

Micro electromechanical switch having self-aligned spacers

Preparation of strained Si/SiGe on insulator by hydrogen induced layer transfer technique

Slurry for mechanical polishing (CMP) of metals and use thereof

Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP)

Method of replenishing electroless gold plating baths

Semiconductor microcooler

Fully aligned via employing selective metal deposition

Hybridization fin reveal for uniform fin reveal depth across different fin pitches

Apparatus and method for electroplating pin grid array packaging modules

Inductive head lamination with layer of magnetic quenching material

Method for planarizing photoresist

Semiconductor microcooler

Dual function magnetic tunnel junction pillar encapsulation

Polysilicon residue removal in nanosheet MOSFETs

Interconnect structure containing a porous low k interconnect dielectric/dielectric cap

Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors

Nanosheet eDRAM

Hybridization fin reveal for uniform fin reveal depth across different fin pitches

Composite manganese nitride/low-K dielectric cap

Semiconductor fabrication method using stop layer

Manufacturable CoWP metal cap process for copper interconnects

Micro electromechanical switch having self-aligned spacers

Low oxygen cleaning for CMP equipment

Dual function magnetic tunnel junction pillar encapsulation

Composite manganese nitride / low-k dielectric cap

Semiconductor microcooler

Semiconductor microcooler

Semiconductor structures of more uniform thickness

Cyclic etch process to remove dummy gate oxide layer for fin field effect transistor fabrication

Materials and method to seal vias in silicon substrates

Conditioning a dielectric substrate for plating thereon

Forming high carbon content flowable dielectric film with low processing damage

Rework of patterned dielectric and metal hardmask films

Hybridization fin reveal for uniform fin reveal depth across different fin pitches

Polysilicon residue removal in nanosheet MOSFETs

Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects

Hybridization fin reveal for uniform fin reveal depth across different fin pitches

Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects

Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects

Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors

Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects

Composite dielectric materials with improved mechanical and electrical properties

Manufacturable CoWP metal cap process for copper interconnects

Surface conversion in chemical mechanical polishing

Reticle carrier

PETRARCA KEVIN S

Method of manufacture of damascene reticle

Reticle carrier

GLOBALFOUNDRIES INC

Wafer bonding using boron and nitrogen based bonding stack