Inventor

KRISHNAN MAHADEVAIYER

US55 patents

⚠️ This page may combine multiple inventors who share the name “KRISHNAN MAHADEVAIYER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KRISHNAN MAHADEVAIYER

IBM

Very low effective dielectric constant interconnect structures and methods for fabricating the same

Method of forming barrier layers for damascene interconnects

Dual etch stop/diffusion barrier for damascene interconnects

Very low effective dielectric constant interconnect Structures and methods for fabricating the same

Selective capping of copper wiring

Process to increase reliability CuBEOL structures

Slurry for mechanical polishing (CMP) of metals and use thereof

Copper recess process with application to selective capping and electroless plating

Method of replenishing electroless gold plating baths

pH-buffered slurry and use thereof for polishing

Selective capping of copper wiring

Copper recess process with application to selective capping and electroless plating

Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology

Encapsulated metal structures for semiconductor devices and MIM capacitors including the same

Encapsulated metal structures for semiconductor devices and MIM capacitors including the same

Noble metal contacts for micro-electromechanical switches

Slurry for mechanical polishing (CMP) of metals and use thereof

Chemical mechanical polishing of multiple material substrates and slurry having improved selectivity

Inductive head lamination with layer of magnetic quenching material

Method for planarizing photoresist

Protective insulating layer and chemical mechanical polishing for polycrystalline thin film solar cells

Through silicon via energy storage devices

Method and process for forming a self-aligned silicide contact

Tetra aza ligand systems as complexing agents for electroless deposition of copper

Method for forming self-aligned metal silicide contacts

Method for forming self-aligned metal silicide contacts

Manufacturable CoWP metal cap process for copper interconnects

Encapsulated metal structures for semiconductor devices and MIM capacitors including the same

Electroless copper plating bath

Group III arsenide material smoothing and chemical mechanical planarization processes

Fabrication of all-solid-state energy storage devices

Silicon surface texturing method for reducing surface reflectance

Method of fabricating MIM capacitor with the encapsulated metal structure serving as the lower plate

Method for fabricating a scanning probe microscope probe

Method of forming noble metal contacts

Tetra aza ligand systems as complexing agents for electroless deposition of copper

Fabrication of all-solid-state energy storage devices

Protective insulating layer and chemical mechanical polishing for polycrystalline thin film solar cells

Manufacturable CoWP metal cap process for copper interconnects

Germanium smoothing and chemical mechanical planarization processes

Germanium smoothing and chemical mechanical planarization processes

CHARNS LESLIE

Chemical mechanical planarization with overburden mask

Shallow trench isolation chemical mechanical planarization

COBB MICHAEL A

Multi-spindle chemical mechanical planarization tool

Multi-spindle chemical mechanical planarization tool

CHANG JOSEPHINE B

Chemical mechanical planarization processes for fabrication of FinFET devices

CABRAL JR CYRIL

Method and process for forming a self-aligned silicide contact

CABRAL JR CRYIL

Implantless dopant segregation for silicide contacts

PETRARCA KEVIN S

Method of manufacture of damascene reticle

ANDO TAKASHI

Fabrication of replacement metal gate devices