Inventor
LEE HAE-HYUNG
KR7 patents
⚠️ This page may combine multiple inventors who share the name “LEE HAE-HYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
5 patentsUS7345882B2Mar 18, 2008
Semiconductor module with heat sink and method thereof
SAMSUNG ELECTRONICS CO LTD35 citations91
US7301233B2Nov 27, 2007
Semiconductor chip package with thermoelectric cooler
SAMSUNG ELECTRONICS CO LTD22 citations91
US7473993B2Jan 6, 2009
Semiconductor stack package and memory module with improved heat dissipation
SAMSUNG ELECTRONICS CO LTD7 citations73
US7705449B2Apr 27, 2010
Cooling apparatus for memory module
SAMSUNG ELECTRONICS CO LTD4 citations61
US7485006B2Feb 3, 2009
Memory module, socket and mounting method providing improved heat dissipating characteristics
SAMSUNG ELECTRONICS CO LTD2 citations61