Inventor

ZENG ZHAO-CHONG

TW12 patents

⚠️ This page may combine multiple inventors who share the name “ZENG ZHAO-CHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIMICRON TECHNOLOGY CORP

4 patents

US7948085B2May 24, 2011

Circuit board structure

UNIMICRON TECHNOLOGY CORP12 citations83

US9129870B2Sep 8, 2015

Package structure having embedded electronic component

UNIMICRON TECHNOLOGY CORP2 citations61

US9232665B2Jan 5, 2016

Method of fabricating packaging substrate having a passive element embedded therein

UNIMICRON TECHNOLOGY CORP1 citations51

US10219390B2Feb 26, 2019

Fabrication method of packaging substrate having embedded passive component

UNIMICRON TECHNOLOGY CORP0 citations50

PHOENIX PREC TECHNOLOGY CORP

2 patents

US7763969B2Jul 27, 2010

Structure with semiconductor chips embeded therein

PHOENIX PREC TECHNOLOGY CORP62 citations97

US7554131B2Jun 30, 2009

Chip embedded package structure and fabrication method thereof

PHOENIX PREC TECHNOLOGY CORP3 citations61

HSU SHIH-PING

2 patents

US8829356B2Sep 9, 2014

Packaging substrate having a passive element embedded therein and method of fabricating the same

HSU SHIH-PING7 citations83

US9179549B2Nov 3, 2015

Packaging substrate having embedded passive component and fabrication method thereof

HSU SHIH-PING3 citations62

ZENG ZHAO CHONG

2 patents

US8242383B2Aug 14, 2012

Packaging substrate with embedded semiconductor component and method for fabricating the same

ZENG ZHAO CHONG2 citations58

US9295159B2Mar 22, 2016

Method for fabricating packaging substrate with embedded semiconductor component

ZENG ZHAO CHONG0 citations48

HSU SHIN-PING

1 patent

US8421213B2Apr 16, 2013

Package structure

HSU SHIN-PING2 citations52

ZENG ZHAO-CHONG

1 patent

US8884429B2Nov 11, 2014

Package structure having embedded electronic component and fabrication method thereof

ZENG ZHAO-CHONG0 citations48