Inventor

AOYA KENGO

JP20 patents

⚠️ This page may combine multiple inventors who share the name “AOYA KENGO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AOYA KENGO

TEXAS INSTRUMENTS INC

Multi-step sintering of metal paste for semiconductor device wire bonding

IC package with half-bridge power module

Semiconductor package with multilayer mold

Conductive members atop semiconductor packages

Embedded die packaging with integrated ceramic substrate

Heat-dissipating wirebonded members on package surfaces

Semiconductor package having an interdigitated mold arrangement

Leaded wafer chip scale packages

Embedded die packaging with integrated ceramic substrate

Electronic package with surface contact wire extensions

Stress buffer layer in embedded package

Embedded die package multichip module

Stress buffer layer in embedded package

Frame design in embedded die package

Power converter module

Fan-out electronic device

Semiconductor device having tapered metal coated sidewalls

MAWATARI KAZUAKI

Protruding TSV tips for enhanced heat dissipation for IC devices

AOYA KENGO

Micro-ball loading device and loading method

TEXAS INSTR INCOPORATED

Transfer mask in micro ball mounter