Inventor

CUMMINGS JASON E

US10 patents

⚠️ This page may combine multiple inventors who share the name “CUMMINGS JASON E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CUMMINGS JASON E

3 patents

US8790991B2Jul 29, 2014

Method and structure for shallow trench isolation to mitigate active shorts

CUMMINGS JASON E6 citations71

US8679941B2Mar 25, 2014

Method to improve wet etch budget in FEOL integration

CUMMINGS JASON E0 citations50

US8232179B2Jul 31, 2012

Method to improve wet etch budget in FEOL integration

CUMMINGS JASON E1 citations50

CHARNS LESLIE

2 patents

US8524606B2Sep 3, 2013

Chemical mechanical planarization with overburden mask

CHARNS LESLIE11 citations80

US8497210B2Jul 30, 2013

Shallow trench isolation chemical mechanical planarization

CHARNS LESLIE2 citations58

CHANG JOSEPHINE B

1 patent

US8513127B2Aug 20, 2013

Chemical mechanical planarization processes for fabrication of FinFET devices

CHANG JOSEPHINE B10 citations82

ABADEER WAGDI W

1 patent

US8110483B2Feb 7, 2012

Forming an extremely thin semiconductor-on-insulator (ETSOI) layer

ABADEER WAGDI W7 citations79

GLOBALFOUNDRIES INC

1 patent

US9263517B2Feb 16, 2016

Extremely thin semiconductor-on-insulator (ETSOI) layer

GLOBALFOUNDRIES INC0 citations52

ANDO TAKASHI

1 patent

US8507383B2Aug 13, 2013

Fabrication of replacement metal gate devices

ANDO TAKASHI0 citations50

BERLINER NATHANIEL C

1 patent

US9018024B2Apr 28, 2015

Creating extremely thin semiconductor-on-insulator (ETSOI) having substantially uniform thickness

BERLINER NATHANIEL C0 citations39