Inventor
KESER LIZABETH ANN
US16 patents
⚠️ This page may combine multiple inventors who share the name “KESER LIZABETH ANN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
11 patentsUS9601472B2Mar 21, 2017
Package on package (POP) device comprising solder connections between integrated circuit device packages
QUALCOMM INC9 citations83
US9171782B2Oct 27, 2015
Stacked redistribution layers on die
QUALCOMM INC6 citations76
US9679873B2Jun 13, 2017
Low profile integrated circuit (IC) package comprising a plurality of dies
QUALCOMM INC6 citations72
US10163687B2Dec 25, 2018
System, apparatus, and method for embedding a 3D component with an interconnect structure
QUALCOMM INC3 citations71
US10141202B2Nov 27, 2018
Semiconductor device comprising mold for top side and sidewall protection
QUALCOMM INC2 citations71
US9985010B2May 29, 2018
System, apparatus, and method for embedding a device in a faceup workpiece
QUALCOMM INC4 citations71
US9379065B2Jun 28, 2016
Crack stopping structure in wafer level packaging (WLP)
QUALCOMM INC5 citations71
US9209110B2Dec 8, 2015
Integrated device comprising wires as vias in an encapsulation layer
QUALCOMM INC2 citations59
US9806052B2Oct 31, 2017
Semiconductor package interconnect
QUALCOMM INC1 citations50
US9318405B2Apr 19, 2016
Wafer level package without sidewall cracking
QUALCOMM INC1 citations47
US9806048B2Oct 31, 2017
Planar fan-out wafer level packaging
QUALCOMM INC0 citations40