Inventor
RAE DAVID FRASER
US13 patents
Patents
13 patentsUS10410971B2Sep 10, 2019
Thermal and electromagnetic interference shielding for die embedded in package substrate
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US9601472B2Mar 21, 2017
Package on package (POP) device comprising solder connections between integrated circuit device packages
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US9484327B2Nov 1, 2016
Package-on-package structure with reduced height
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US9679873B2Jun 13, 2017
Low profile integrated circuit (IC) package comprising a plurality of dies
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US9601435B2Mar 21, 2017
Semiconductor package with embedded components and method of making the same
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US10163687B2Dec 25, 2018
System, apparatus, and method for embedding a 3D component with an interconnect structure
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US9985010B2May 29, 2018
System, apparatus, and method for embedding a device in a faceup workpiece
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US11670599B2Jun 6, 2023
Package comprising passive device configured as electromagnetic interference shield
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US9355898B2May 31, 2016
Package on package (PoP) integrated device comprising a plurality of solder resist layers
QUALCOMM INC2 citations60
US11404343B2Aug 2, 2022
Package comprising a substrate configured as a heat spreader
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US11502049B2Nov 15, 2022
Package comprising multi-level vertically stacked redistribution portions
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US11393808B2Jul 19, 2022
Ultra-low profile stacked RDL semiconductor package
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US9806048B2Oct 31, 2017
Planar fan-out wafer level packaging
QUALCOMM INC0 citations40