Inventor
HERNDON MARY K
US17 patents
⚠️ This page may combine multiple inventors who share the name “HERNDON MARY K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
13 patentsUS10839992B1Nov 17, 2020
Thick film resistors having customizable resistances and methods of manufacture
RAYTHEON CO5 citations79
US9974160B1May 15, 2018
Interconnection system for a multilayered radio frequency circuit and method of fabrication
RAYTHEON CO4 citations72
US8350777B2Jan 8, 2013
Metamaterial radome/isolator
RAYTHEON CO6 citations67
US11145952B2Oct 12, 2021
Advanced communications array
RAYTHEON CO0 citations61
US11632856B2Apr 18, 2023
Wall for isolation enhancement
RAYTHEON CO0 citations59
US11089673B2Aug 10, 2021
Wall for isolation enhancement
RAYTHEON CO0 citations59
US11107610B2Aug 31, 2021
Thick film resistors having customizable resistances and methods of manufacture
RAYTHEON CO0 citations58
US11899277B2Feb 13, 2024
Congruently melting high purity titanium alloy for optical mounts, flexures, and structural elements requiring compliance
RAYTHEON CO0 citations56
US11714258B2Aug 1, 2023
Congruently melting high purity titanium alloy for optical mounts, flexures, and structural elements requiring compliance
RAYTHEON CO0 citations56
US12362450B2Jul 15, 2025
Additively manufactured cluster connector
RAYTHEON CO0 citations52
US11075141B2Jul 27, 2021
Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices
RAYTHEON CO0 citations52
US12496648B2Dec 16, 2025
Furnace braze cycle enhancement
RAYTHEON CO0 citations51
US11993026B2May 28, 2024
Multi-functional interface/surface layer for thermoplastic components
RAYTHEON CO0 citations41
KORENSTEIN RALPH
2 patentsUS8698161B2Apr 15, 2014
Semiconductor structures having directly bonded diamond heat sinks and methods for making such structures
KORENSTEIN RALPH1 citations47
US8450185B2May 28, 2013
Semiconductor structures having directly bonded diamond heat sinks and methods for making such structures
KORENSTEIN RALPH1 citations47