Inventor
JANG BYEONGDECK
JP22 patents
Patents
22 patentsUS10937668B2Mar 2, 2021
Semiconductor package manufacturing method
DISCO CORP3 citations72
US10403520B2Sep 3, 2019
Multi-blade and processing method of workpiece
DISCO CORP3 citations68
US11183464B2Nov 23, 2021
Package substrate processing method and protective tape
DISCO CORP1 citations62
US10211164B2Feb 19, 2019
Semiconductor package manufacturing method
DISCO CORP1 citations62
US11682569B2Jun 20, 2023
Workpiece cutting method
DISCO CORP0 citations51
US11322476B2May 3, 2022
Manufacturing method of producing shielded individual semiconductor packages
DISCO CORP0 citations51
US11289348B2Mar 29, 2022
Workpiece processing method
DISCO CORP0 citations51
US11133198B2Sep 28, 2021
Method of manufacturing packaged device chip
DISCO CORP0 citations51
US11114385B2Sep 7, 2021
Plate-shaped workpiece processing method
DISCO CORP0 citations51
US12300545B2May 13, 2025
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US12198990B2Jan 14, 2025
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11854891B2Dec 26, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11764114B2Sep 19, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11764115B2Sep 19, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11756831B2Sep 12, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11590629B2Feb 28, 2023
Method of processing workpiece and resin sheet unit
DISCO CORP0 citations50
US11508607B2Nov 22, 2022
Method of processing workpiece and resin sheet unit
DISCO CORP0 citations50
US10861716B2Dec 8, 2020
Processing method for package substrate
DISCO CORP0 citations41
US10515841B2Dec 24, 2019
Method for dividing substrate along division lines using abrasive member having projection for cutting substrate
DISCO CORP0 citations41
US10497623B2Dec 3, 2019
Method of manufacturing a semiconductor package including a shield layer
DISCO CORP0 citations41
US10431555B2Oct 1, 2019
Method of manufacturing semiconductor package
DISCO CORP0 citations41
US10366907B2Jul 30, 2019
Manufacturing method of semiconductor package
DISCO CORP0 citations41