Inventor
SUBRAMANI CHANDRAMOULEESWARAN
US5 patents
⚠️ This page may combine multiple inventors who share the name “SUBRAMANI CHANDRAMOULEESWARAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS11319334B2May 3, 2022
Site-selective metal plating onto a package dielectric
INTEL CORP2 citations67
US11908820B2Feb 20, 2024
Dual solder methodologies for ultrahigh density first level interconnections
INTEL CORP0 citations56
US11322469B2May 3, 2022
Dual solder methodologies for ultrahigh density first level interconnections
INTEL CORP0 citations56
US9147603B2Sep 29, 2015
Polymer grafting for enhanced dielectric and interconnect material adhesion
INTEL CORP1 citations48