Inventor

Xie Biancun

US4 patents

⚠️ This page may combine multiple inventors who share the name “Xie Biancun”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUALCOMM INC

3 patents

US11749661B2Sep 5, 2023

Package comprising a substrate and a multi-capacitor integrated passive device

QUALCOMM INC0 citations57

US11626359B2Apr 11, 2023

Three-dimensional integrated circuit (3D IC) power distribution network (PDN) capacitor integration

QUALCOMM INC1 citations57

US12160952B2Dec 3, 2024

Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods

QUALCOMM INC0 citations49

INTEL CORP

1 patent

US12341129B2Jun 24, 2025

Substrateless double-sided embedded multi-die interconnect bridge

INTEL CORP0 citations50