Inventor

LEE KWANG JOO

KR56 patents

⚠️ This page may combine multiple inventors who share the name “LEE KWANG JOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE KWANG JOO

LG CHEMICAL LTD

Composition for forming adhesive layer of dicing film, and dicing film

Adhesive resin compostition for bonding semiconductors and adhesive film for semiconductors

Dicing film and dicing die-bonding film

Method for manufacturing semiconductor package

Method for manufacturing heating element

Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist

Adhesive film for semiconductor

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing the same using an adhesive

Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same

Adhesive composition for semiconductor circuit connection and adhesive film containing the same

Adhesive composition for semiconductor circuit connection and adhesive film including the same

Photo-curable and thermo-curable resin compostion, and dry film solder resist

Photo-curable and thermo-curable resin composition, and a dry film solder resist

Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

Non-conductive film and manufacturing method of semiconductor laminate

Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same

Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same

Adhesive composition for dicing tape and dicing tape including the same

Adhesive composition for dicing tape and dicing tape comprising the same

Back-grinding tape

Semiconductor adhesive composition and semiconductor adhesive film comprising cured product thereof

Apparatus for separating semiconductor chip and method for separating semiconductor by using same

Resin composition for bonding semiconductor and adhesive film for semiconductor using the same

Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same

Back grinding tape

Dicing die-bonding film

Adhesive film, preparation method of semiconductor device, and semiconductor device

Semiconductor device

Adhesive film for semiconductor

Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film

Semiconductor device and method for manufacturing semiconductor device

Adhesive resin composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film

Adhesive composition for semiconductor circuit connection and adhesive film containing the same

Photocurable and thermocurable resin composition and dry film solder resist

Photo-curable and thermo-curable resin composition, and dry film solder resist

Adhesive sheet for temporary attachment and method for producing semiconductor device using the same

Method for manufacturing insulating film and semiconductor package

Photo-curable and thermo-curable resin composition and dry film solder resist

Adhesive composition

Resin composition for bonding semiconductors, adhesive film for semiconductor using the same, dicing die bonding film, and method for dicing semiconductor wafer

Adhesive film for semiconductor, and semiconductor device

Composition for forming adhesive layer of dicing film, and dicing film

Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer film

Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer film

LEE KWANG-JOO

Low temperature curable photosensitive resin composition and dry film manufactured by using the same

KYUNG YOU-JIN

Polyamic acid, photosensitive resin composition, dry film and circuit board

CHOI BO-YUN

Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical property

FAG BEARINGS KOREA CORP

Apparatus for sealing a water pump bearing