P

Inventor

KANG SANG BOM

KR52 patents
⚠️ This page may combine multiple inventors who share the name “KANG SANG BOM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

38 patents
US6399491B2Jun 4, 2002

Method of manufacturing a barrier metal layer using atomic layer deposition

SAMSUNG ELECTRONICS CO LTD342 citations99
US6348376B2Feb 19, 2002

Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact and capacitor of semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD254 citations99
US6197683B1Mar 6, 2001

Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact of semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD316 citations99
US6174809B1Jan 16, 2001

Method for forming metal layer using atomic layer deposition

SAMSUNG ELECTRONICS CO LTD1,166 citations99
US6139700AOct 31, 2000

Method of and apparatus for forming a metal interconnection in the contact hole of a semiconductor device

SAMSUNG ELECTRONICS CO LTD410 citations99
US7521331B2Apr 21, 2009

High dielectric film and related method of manufacture

SAMSUNG ELECTRONICS CO LTD64 citations98
US6590251B2Jul 8, 2003

Semiconductor devices having metal layers as barrier layers on upper or lower electrodes of capacitors

SAMSUNG ELECTRONICS CO LTD627 citations98
US6478872B1Nov 12, 2002

Method of delivering gas into reaction chamber and shower head used to deliver gas

SAMSUNG ELECTRONICS CO LTD814 citations98
US6458701B1Oct 1, 2002

Method for forming metal layer of semiconductor device using metal halide gas

SAMSUNG ELECTRONICS CO LTD238 citations98
US6287965B1Sep 11, 2001

Method of forming metal layer using atomic layer deposition and semiconductor device having the metal layer as barrier metal layer or upper or lower electrode of capacitor

SAMSUNG ELECTRONICS CO LTD1,252 citations98
US7081409B2Jul 25, 2006

Methods of producing integrated circuit devices utilizing tantalum amine derivatives

SAMSUNG ELECTRONICS CO LTD50 citations96
US7214620B2May 8, 2007

Methods of forming silicide films with metal films in semiconductor devices and contacts including the same

SAMSUNG ELECTRONICS CO LTD26 citations92
US7098131B2Aug 29, 2006

Methods for forming atomic layers and thin films including tantalum nitride and devices including the same

SAMSUNG ELECTRONICS CO LTD48 citations92
US7833855B2Nov 16, 2010

Methods of producing integrated circuit devices utilizing tantalum amine derivatives

SAMSUNG ELECTRONICS CO LTD10 citations84
US7452811B2Nov 18, 2008

Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the same

SAMSUNG ELECTRONICS CO LTD10 citations84
US7390719B2Jun 24, 2008

Method of manufacturing a semiconductor device having a dual gate structure

SAMSUNG ELECTRONICS CO LTD10 citations84
US7211506B2May 1, 2007

Methods of forming cobalt layers for semiconductor devices

SAMSUNG ELECTRONICS CO LTD12 citations84
US7172967B2Feb 6, 2007

Methods for forming cobalt layers including introducing vaporized cobalt precursors and methods for manufacturing semiconductor devices using the same

SAMSUNG ELECTRONICS CO LTD19 citations84
US9299811B2Mar 29, 2016

Methods of fabricating semiconductor devices

SAMSUNG ELECTRONICS CO LTD7 citations83
US7521357B2Apr 21, 2009

Methods of forming metal wiring in semiconductor devices using etch stop layers

SAMSUNG ELECTRONICS CO LTD7 citations74
US10388563B2Aug 20, 2019

Semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations73
US7105444B2Sep 12, 2006

Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the same

SAMSUNG ELECTRONICS CO LTD6 citations73
US7056776B2Jun 6, 2006

Semiconductor devices having metal containing N-type and P-type gate electrodes and methods of forming the same

SAMSUNG ELECTRONICS CO LTD8 citations73
US7045842B2May 16, 2006

Integrated circuit devices having self-aligned contact structures

SAMSUNG ELECTRONICS CO LTD6 citations73
US7692196B2Apr 6, 2010

Memory devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US10847454B2Nov 24, 2020

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD1 citations62
US10510658B2Dec 17, 2019

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD1 citations62
US9305921B2Apr 5, 2016

Semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations62
US7531881B2May 12, 2009

Semiconductor devices having transistors with different gate structures and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations62
US7494859B2Feb 24, 2009

Semiconductor device having metal gate patterns and related method of manufacture

SAMSUNG ELECTRONICS CO LTD4 citations62
US7285493B2Oct 23, 2007

Methods of forming a metal layer using transition metal precursors

SAMSUNG ELECTRONICS CO LTD2 citations62
US7892958B2Feb 22, 2011

Methods of fabricating semiconductor devices having transistors with different gate structures

SAMSUNG ELECTRONICS CO LTD0 citations52
US7459372B2Dec 2, 2008

Methods of manufacturing a thin film including hafnium titanium oxide and methods of manufacturing a semiconductor device including the same

SAMSUNG ELECTRONICS CO LTD1 citations52
US7410892B2Aug 12, 2008

Methods of fabricating integrated circuit devices having self-aligned contact structures

SAMSUNG ELECTRONICS CO LTD1 citations52
US7399670B2Jul 15, 2008

Methods of forming different gate structures in NMOS and PMOS regions and gate structures so formed

SAMSUNG ELECTRONICS CO LTD0 citations52
US11127739B2Sep 21, 2021

Methods of fabricating semiconductor devices using MOS transistors with nonuniform gate electrode structures

SAMSUNG ELECTRONICS CO LTD0 citations51
US7910421B2Mar 22, 2011

Methods of forming devices including different gate insulating layers on PMOS/NMOS regions

SAMSUNG ELECTRONICS CO LTD0 citations49
US7312150B2Dec 25, 2007

Method of forming cobalt disilicide layer and method of manufacturing semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD0 citations42

LEE JUNG-CHAN

2 patents

LEE SEUNG-HUN

2 patents

SHIN CHUNG HWAN

2 patents

KIM SEOK-HOON

1 patent

NA HOON-JOO

1 patent

SHIN CHUNG-HWAN

1 patent

PARK HEUNG-KYU

1 patent

LIM KWAN-YONG

1 patent

LEE KWAN-HEUM

1 patent

Showing the top 50 of 52 patents by PatentIndex Score.