Inventor · disambiguated record
Solomon I. Beilin
Also filed as: BEILIN SOLOMON · BEILIN SOLOMON I · BEILIN SOLOMON ISAAC
58 granted patents·1 pending application·5,763 citations·filing 1985–2001
99Inventor score
Top patents by PatentIndex Score
59 records- 0199US6684007B2Optical coupling structures and the fabrication processesFUJITSU LTD·Filed 2001·Granted Jan 27, 2004·249 cites·4 claims
- 0299US6444921B1Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the likeFUJITSU LTD·Filed 2000·Granted Sep 3, 2002·200 cites·39 claims
- 0398US6690845B1Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 2000·Granted Feb 10, 2004·334 cites·19 claims
- 0498US6343171B1Systems based on opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Jan 29, 2002·429 cites·26 claims
- 0598US6239485B1Reduced cross-talk noise high density signal interposer with power and ground wrapFUJITSU LTD·Filed 1999·Granted May 29, 2001·194 cites·6 claims
- 0698US6187652B1Method of fabrication of multiple-layer high density substrateFUJITSU LTD·Filed 1998·Granted Feb 13, 2001·177 cites·18 claims
- 0798US6050832AChip and board stress relief interposerFUJITSU LTD·Filed 1998·Granted Apr 18, 2000·221 cites·17 claims
- 0898US5334804AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1992·Granted Aug 2, 1994·280 cites·25 claims
- 0997US6845184B1Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Jan 18, 2005·286 cites·25 claims
- 1097US6785447B2Single and multilayer waveguides and fabrication processFUJITSU LTD·Filed 2001·Granted Aug 31, 2004·143 cites·7 claims
- 1197US6572780B2Methods for fabricating flexible circuit structuresFUJITSU LTD·Filed 2001·Granted Jun 3, 2003·99 cites·7 claims
- 1297US6544430B2Methods for detaching a layer from a substrateFUJITSU LTD·Filed 2001·Granted Apr 8, 2003·118 cites·8 claims
- 1397US6039889AProcess flows for formation of fine structure layer pairs on flexible filmsFUJITSU LTD·Filed 1999·Granted Mar 21, 2000·156 cites·20 claims
- 1497US5454161AThrough hole interconnect substrate fabrication processFUJITSU LTD·Filed 1993·Granted Oct 3, 1995·256 cites·26 claims
- 1596US6706546B2Optical reflective structures and method for makingFUJITSU LTD·Filed 2001·Granted Mar 16, 2004·143 cites·38 claims
- 1696US6611635B1Opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Aug 26, 2003·193 cites·45 claims
- 1796US5854534AControlled impedence interposer substrateFUJITSU LTD·Filed 1995·Granted Dec 29, 1998·238 cites·23 claims
- 1895US6054761AMulti-layer circuit substrates and electrical assemblies having conductive composition connectorsFUJITSU LTD·Filed 1998·Granted Apr 25, 2000·103 cites·38 claims
- 1995US5773889AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1996·Granted Jun 30, 1998·162 cites·20 claims
- 2094US6733685B2Methods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 2001·Granted May 11, 2004·64 cites·14 claims
- 2194US5419038AMethod for fabricating thin-film interconnectorFUJITSU LTD·Filed 1993·Granted May 30, 1995·96 cites·33 claims
- 2293US6391220B1Methods for fabricating flexible circuit structuresFUJITSU LTD INC·Filed 1999·Granted May 21, 2002·162 cites·30 claims
- 2393US6326555B1Method and structure of z-connected laminated substrate for high density electronic packagingFUJITSU LTD·Filed 1999·Granted Dec 4, 2001·93 cites·44 claims
- 2493US5660957AElectron-beam treatment procedure for patterned mask layersFUJITSU LTD·Filed 1996·Granted Aug 26, 1997·135 cites·10 claims
- 2591US5474458AInterconnect carriers having high-density vertical connectors and methods for making the sameFUJITSU LTD·Filed 1993·Granted Dec 12, 1995·136 cites·33 claims
- 2690US6662443B2Method of fabricating a substrate with a via connectionFUJITSU LTD·Filed 2001·Granted Dec 16, 2003·47 cites·46 claims
- 2789US5722162AFabrication procedure for a stable postFUJITSU LTD·Filed 1995·Granted Mar 3, 1998·97 cites·16 claims
- 2889US5544017AMultichip module substrateFUJITSU LTD·Filed 1994·Granted Aug 6, 1996·91 cites·14 claims
- 2989US5536362AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1994·Granted Jul 16, 1996·85 cites·25 claims
- 3087US5872696ASputtered and anodized capacitors capable of withstanding exposure to high temperaturesFUJITSU LTD·Filed 1997·Granted Feb 16, 1999·69 cites·32 claims
- 3186US6081026AHigh density signal interposer with power and ground wrapFUJITSU LTD·Filed 1998·Granted Jun 27, 2000·61 cites·6 claims
- 3286US4620916ADegradation retardants for electrophoretic display devicesZWEMER DIRK A·Filed 1985·Granted Nov 4, 1986·106 cites·24 claims
- 3385US6102710AControlled impedance interposer substrate and method of makingFUJITSU LTD·Filed 1998·Granted Aug 15, 2000·68 cites·18 claims
- 3478US6034332APower supply distribution structure for integrated circuit chip modulesFUJITSU LTD·Filed 1998·Granted Mar 7, 2000·47 cites·13 claims
- 3577US5891354AMethods of etching through wafers and substrates with a composite etch stop layerFUJITSU LTD·Filed 1996·Granted Apr 6, 1999·50 cites·20 claims
- 3676US6509529B2Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatchKULICKE & SOFFA HOLDINGS INC·Filed 2001·Granted Jan 21, 2003·17 cites·16 claims
- 3774US5916453AMethods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 1996·Granted Jun 29, 1999·38 cites·22 claims
- 3871US5789140AMethod of forming a pattern or via structure utilizing supplemental electron beam exposure and development to remove image residueFUJITSU LTD·Filed 1996·Granted Aug 4, 1998·25 cites·10 claims
- 3970US6317331B1Wiring substrate with thermal insertKULICKE & SOFFA HOLDINGS INC·Filed 1999·Granted Nov 13, 2001·37 cites·14 claims
- 4070US5323520AProcess for fabricating a substrate with thin film capacitorFUJITSU LTD·Filed 1993·Granted Jun 28, 1994·35 cites·26 claims
- 4161US6579474B2Conductive compositionFUJITSU LTD·Filed 2001·Granted Jun 17, 2003·6 cites·20 claims
- 4260US6226171B1Power conducting substrates with high-yield integrated substrate capacitorFUJITSU LTD·Filed 1999·Granted May 1, 2001·24 cites·22 claims
- 4360US5746903AWet chemical processing techniques for plating high aspect ratio featuresFUJITSU LTD·Filed 1996·Granted May 5, 1998·14 cites·10 claims
- 4458US5765279AMethods of manufacturing power supply distribution structures for multichip modulesFUJITSU LTD·Filed 1995·Granted Jun 16, 1998·20 cites·48 claims
- 4557US6090214ACleaning method using ammonium persulphate to remove slurry particles from CMP substratesFUJITSU LTD·Filed 1998·Granted Jul 18, 2000·14 cites·18 claims
- 4657US5376586AMethod of curing thin films of organic dielectric materialFUJITSU LTD·Filed 1993·Granted Dec 27, 1994·23 cites·9 claims
- 4755US6299053B1Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatchKULICKE & SOFFA HOLDINGS INC·Filed 1999·Granted Oct 9, 2001·14 cites·4 claims
- 4854US6866741B2Method for joining large substratesFUJITSU LTD·Filed 2001·Granted Mar 15, 2005·5 cites·21 claims
- 4953US5406446AThin film capacitorFUJITSU LTD·Filed 1994·Granted Apr 11, 1995·17 cites·7 claims
- 5052US6146241AApparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotationFUJITSU LTD·Filed 1997·Granted Nov 14, 2000·15 cites·24 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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