Inventor
SRIRAMAN SARAVANAPRIYAN
US35 patents
⚠️ This page may combine multiple inventors who share the name “SRIRAMAN SARAVANAPRIYAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
34 patentsUS9053908B2Jun 9, 2015
Method and apparatus for controlling substrate DC-bias and ion energy and angular distribution during substrate etching
LAM RES CORP56 citations98
US7303999B1Dec 4, 2007
Multi-step method for etching strain gate recesses
LAM RES CORP95 citations96
US10197908B2Feb 5, 2019
Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework
LAM RES CORP27 citations94
US10254641B2Apr 9, 2019
Layout pattern proximity correction through fast edge placement error prediction
LAM RES CORP32 citations93
US9792393B2Oct 17, 2017
Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
LAM RES CORP19 citations92
US10534257B2Jan 14, 2020
Layout pattern proximity correction through edge placement error prediction
LAM RES CORP17 citations86
US10585347B2Mar 10, 2020
Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework
LAM RES CORP9 citations84
US10386828B2Aug 20, 2019
Methods and apparatuses for etch profile matching by surface kinetic model optimization
LAM RES CORP8 citations84
US10303830B2May 28, 2019
Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
LAM RES CORP9 citations84
US9996647B2Jun 12, 2018
Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
LAM RES CORP12 citations84
US10572697B2Feb 25, 2020
Method of etch model calibration using optical scatterometry
LAM RES CORP9 citations83
US10410832B2Sep 10, 2019
Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment
LAM RES CORP8 citations83
US10262867B2Apr 16, 2019
Fast-gas switching for etching
LAM RES CORP4 citations73
US10249511B2Apr 2, 2019
Ceramic showerhead including central gas injector for tunable convective-diffusive gas flow in semiconductor substrate processing apparatus
LAM RES CORP2 citations73
US10242845B2Mar 26, 2019
Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber
LAM RES CORP2 citations73
US9966270B2May 8, 2018
Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch feature profile uniformity
LAM RES CORP2 citations73
US9885493B2Feb 6, 2018
Air cooled faraday shield and methods for using the same
LAM RES CORP4 citations73
US11704463B2Jul 18, 2023
Method of etch model calibration using optical scatterometry
LAM RES CORP1 citations72
US10997345B2May 4, 2021
Method of etch model calibration using optical scatterometry
LAM RES CORP3 citations72
US10163610B2Dec 25, 2018
Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
LAM RES CORP3 citations72
US11171021B2Nov 9, 2021
Internal plasma grid for semiconductor fabrication
LAM RES CORP0 citations63
US9275869B2Mar 1, 2016
Fast-gas switching for etching
LAM RES CORP1 citations63
US12068152B2Aug 20, 2024
Semiconductor substrate bevel cleaning
LAM RES CORP0 citations62
US11887819B2Jan 30, 2024
Systems for cooling RF heated chamber components
LAM RES CORP0 citations62
US11692732B2Jul 4, 2023
Air cooled faraday shield and methods for using the same
LAM RES CORP0 citations62
US11624981B2Apr 11, 2023
Resist and etch modeling
LAM RES CORP1 citations62
US11495441B2Nov 8, 2022
Systems for cooling RF heated chamber components
LAM RES CORP0 citations62
US11424103B2Aug 23, 2022
Control of on-wafer cd uniformity with movable edge ring and gas injection adjustment
LAM RES CORP0 citations62
US10825661B2Nov 3, 2020
Systems for cooling RF heated chamber components
LAM RES CORP0 citations52
US10690374B2Jun 23, 2020
Air cooled faraday shield and methods for using the same
LAM RES CORP0 citations52
US10460951B2Oct 29, 2019
Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch feature profile uniformity
LAM RES CORP0 citations52
US9640408B2May 2, 2017
Fast-gas switching for etching
LAM RES CORP0 citations52
US11538666B2Dec 27, 2022
Multi-zone cooling of plasma heated window
LAM RES CORP0 citations50
US12530021B2Jan 20, 2026
Performance predictors for semiconductor-manufacturing processes
LAM RES CORP0 citations47