P

Inventor

SRIRAMAN SARAVANAPRIYAN

US35 patents
⚠️ This page may combine multiple inventors who share the name “SRIRAMAN SARAVANAPRIYAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

34 patents
US9053908B2Jun 9, 2015

Method and apparatus for controlling substrate DC-bias and ion energy and angular distribution during substrate etching

LAM RES CORP56 citations98
US7303999B1Dec 4, 2007

Multi-step method for etching strain gate recesses

LAM RES CORP95 citations96
US10197908B2Feb 5, 2019

Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework

LAM RES CORP27 citations94
US10254641B2Apr 9, 2019

Layout pattern proximity correction through fast edge placement error prediction

LAM RES CORP32 citations93
US9792393B2Oct 17, 2017

Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization

LAM RES CORP19 citations92
US10534257B2Jan 14, 2020

Layout pattern proximity correction through edge placement error prediction

LAM RES CORP17 citations86
US10585347B2Mar 10, 2020

Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework

LAM RES CORP9 citations84
US10386828B2Aug 20, 2019

Methods and apparatuses for etch profile matching by surface kinetic model optimization

LAM RES CORP8 citations84
US10303830B2May 28, 2019

Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization

LAM RES CORP9 citations84
US9996647B2Jun 12, 2018

Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization

LAM RES CORP12 citations84
US10572697B2Feb 25, 2020

Method of etch model calibration using optical scatterometry

LAM RES CORP9 citations83
US10410832B2Sep 10, 2019

Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment

LAM RES CORP8 citations83
US10262867B2Apr 16, 2019

Fast-gas switching for etching

LAM RES CORP4 citations73
US10249511B2Apr 2, 2019

Ceramic showerhead including central gas injector for tunable convective-diffusive gas flow in semiconductor substrate processing apparatus

LAM RES CORP2 citations73
US10242845B2Mar 26, 2019

Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber

LAM RES CORP2 citations73
US9966270B2May 8, 2018

Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch feature profile uniformity

LAM RES CORP2 citations73
US9885493B2Feb 6, 2018

Air cooled faraday shield and methods for using the same

LAM RES CORP4 citations73
US11704463B2Jul 18, 2023

Method of etch model calibration using optical scatterometry

LAM RES CORP1 citations72
US10997345B2May 4, 2021

Method of etch model calibration using optical scatterometry

LAM RES CORP3 citations72
US10163610B2Dec 25, 2018

Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation

LAM RES CORP3 citations72
US11171021B2Nov 9, 2021

Internal plasma grid for semiconductor fabrication

LAM RES CORP0 citations63
US9275869B2Mar 1, 2016

Fast-gas switching for etching

LAM RES CORP1 citations63
US12068152B2Aug 20, 2024

Semiconductor substrate bevel cleaning

LAM RES CORP0 citations62
US11887819B2Jan 30, 2024

Systems for cooling RF heated chamber components

LAM RES CORP0 citations62
US11692732B2Jul 4, 2023

Air cooled faraday shield and methods for using the same

LAM RES CORP0 citations62
US11624981B2Apr 11, 2023

Resist and etch modeling

LAM RES CORP1 citations62
US11495441B2Nov 8, 2022

Systems for cooling RF heated chamber components

LAM RES CORP0 citations62
US11424103B2Aug 23, 2022

Control of on-wafer cd uniformity with movable edge ring and gas injection adjustment

LAM RES CORP0 citations62
US10825661B2Nov 3, 2020

Systems for cooling RF heated chamber components

LAM RES CORP0 citations52
US10690374B2Jun 23, 2020

Air cooled faraday shield and methods for using the same

LAM RES CORP0 citations52
US10460951B2Oct 29, 2019

Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch feature profile uniformity

LAM RES CORP0 citations52
US9640408B2May 2, 2017

Fast-gas switching for etching

LAM RES CORP0 citations52
US11538666B2Dec 27, 2022

Multi-zone cooling of plasma heated window

LAM RES CORP0 citations50
US12530021B2Jan 20, 2026

Performance predictors for semiconductor-manufacturing processes

LAM RES CORP0 citations47

MCCHESNEY JON

1 patent