Inventor
PATERSON ALEX
US104 patents
⚠️ This page may combine multiple inventors who share the name “PATERSON ALEX”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
42 patentsUS9583357B1Feb 28, 2017
Systems and methods for reverse pulsing
LAM RES CORP98 citations99
US9761459B2Sep 12, 2017
Systems and methods for reverse pulsing
LAM RES CORP93 citations98
US9515633B1Dec 6, 2016
Transformer coupled capacitive tuning circuit with fast impedance switching for plasma etch chambers
LAM RES CORP60 citations98
US9017526B2Apr 28, 2015
Ion beam etching system
LAM RES CORP48 citations98
US10264663B1Apr 16, 2019
Matchless plasma source for semiconductor wafer fabrication
LAM RES CORP29 citations97
US9881820B2Jan 30, 2018
Front opening ring pod
LAM RES CORP124 citations97
US9099398B2Aug 4, 2015
Gas distribution showerhead for inductively coupled plasma etch reactor
LAM RES CORP41 citations97
US10197908B2Feb 5, 2019
Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework
LAM RES CORP27 citations94
US9059678B2Jun 16, 2015
TCCT match circuit for plasma etch chambers
LAM RES CORP29 citations94
US10124492B2Nov 13, 2018
Automated replacement of consumable parts using end effectors interfacing with plasma processing system
LAM RES CORP25 citations93
US10062590B2Aug 28, 2018
Front opening ring pod
LAM RES CORP23 citations93
US10062599B2Aug 28, 2018
Automated replacement of consumable parts using interfacing chambers
LAM RES CORP30 citations93
US10062589B2Aug 28, 2018
Front opening ring pod
LAM RES CORP20 citations93
US9257295B2Feb 9, 2016
Ion beam etching system
LAM RES CORP20 citations93
US10638593B2Apr 28, 2020
Matchless plasma source for semiconductor wafer fabrication
LAM RES CORP10 citations92
US10224183B1Mar 5, 2019
Multi-level parameter and frequency pulsing with a low angular spread
LAM RES CORP12 citations92
US9792393B2Oct 17, 2017
Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
LAM RES CORP19 citations92
US9245761B2Jan 26, 2016
Internal plasma grid for semiconductor fabrication
LAM RES CORP21 citations92
US11716805B2Aug 1, 2023
Matchless plasma source for semiconductor wafer fabrication
LAM RES CORP4 citations85
US11224116B2Jan 11, 2022
Matchless plasma source for semiconductor wafer fabrication
LAM RES CORP4 citations84
US10784083B2Sep 22, 2020
RF voltage sensor incorporating multiple voltage dividers for detecting RF voltages at a pickup device of a substrate support
LAM RES CORP8 citations84
US10585347B2Mar 10, 2020
Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework
LAM RES CORP9 citations84
US10573494B2Feb 25, 2020
Multi-level parameter and frequency pulsing with a low angular spread
LAM RES CORP8 citations84
US10386828B2Aug 20, 2019
Methods and apparatuses for etch profile matching by surface kinetic model optimization
LAM RES CORP8 citations84
US10303830B2May 28, 2019
Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
LAM RES CORP9 citations84
US10304660B1May 28, 2019
Multi-level pulsing of DC and RF signals
LAM RES CORP5 citations84
US10224221B2Mar 5, 2019
Internal plasma grid for semiconductor fabrication
LAM RES CORP7 citations84
US10141163B2Nov 27, 2018
Controlling ion energy within a plasma chamber
LAM RES CORP8 citations84
US10121641B2Nov 6, 2018
Large dynamic range RF voltage sensor and method for voltage mode RF bias application of plasma processing systems
LAM RES CORP8 citations84
US9996647B2Jun 12, 2018
Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
LAM RES CORP12 citations84
US9460894B2Oct 4, 2016
Controlling ion energy within a plasma chamber
LAM RES CORP11 citations84
US10410832B2Sep 10, 2019
Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment
LAM RES CORP8 citations83
US10658222B2May 19, 2020
Moveable edge coupling ring for edge process control during semiconductor wafer processing
LAM RES CORP7 citations82
US9633846B2Apr 25, 2017
Internal plasma grid applications for semiconductor fabrication
LAM RES CORP8 citations81
US9230819B2Jan 5, 2016
Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processing
LAM RES CORP15 citations81
US11728136B2Aug 15, 2023
RF pulsing within pulsing for semiconductor RF plasma processing
LAM RES CORP2 citations73
US11605546B2Mar 14, 2023
Moveable edge coupling ring for edge process control during semiconductor wafer processing
LAM RES CORP2 citations73
US11462390B2Oct 4, 2022
Multi-level parameter and frequency pulsing with a low angular spread
LAM RES CORP2 citations73
US11342159B2May 24, 2022
RF pulsing within pulsing for semiconductor RF plasma processing
LAM RES CORP2 citations73
US11049693B2Jun 29, 2021
Systems and methods for achieving peak ion energy enhancement with a low angular spread
LAM RES CORP1 citations73
US10715095B2Jul 14, 2020
Radiofrequency (RF) filter for multi-frequency RF bias
LAM RES CORP2 citations73
US10679825B2Jun 9, 2020
Systems and methods for applying frequency and match tuning in a non-overlapping manner for processing substrate
LAM RES CORP3 citations73
KANG MICHAEL
2 patentsAPPLIED MATERIALS INC
2 patentsLONG MAOLIN
2 patents(unassigned)
1 patentMCCHESNEY JON
1 patentShowing the top 50 of 104 patents by PatentIndex Score.