Inventor

HWANG TAE-JOO

KR19 patents

⚠️ This page may combine multiple inventors who share the name “HWANG TAE-JOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HWANG TAE-JOO

SAMSUNG ELECTRONICS CO LTD

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

Semiconductor package

Semiconductor packages

Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same

Semiconductor device package

Electronic device including semiconductor device package

Semiconductor package

Semiconductor package including dummy board and method of fabricating the same

Flip-chip assembly and method of manufacturing the same

Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold

Semiconductor package including stacked semiconductor chips electrically connected to redistribution layers

HWANG TAE-JOO

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

LEE JONG-JOO

Flip chip package

Flip chip package

CHOE YEONG HWAN

Semiconductor device having stacked semiconductor chips interconnected via TSV