Inventor
EMESH ISMAIL
US18 patents
⚠️ This page may combine multiple inventors who share the name “EMESH ISMAIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SPEEDFAM IPEC CORP
7 patentsUS6736952B2May 18, 2004
Method and apparatus for electrochemical planarization of a workpiece
SPEEDFAM IPEC CORP155 citations98
US7033464B2Apr 25, 2006
Apparatus for electrochemically depositing a material onto a workpiece surface
SPEEDFAM IPEC CORP23 citations92
US6572755B2Jun 3, 2003
Method and apparatus for electrochemically depositing a material onto a workpiece surface
SPEEDFAM IPEC CORP33 citations92
US6802955B2Oct 12, 2004
Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
SPEEDFAM IPEC CORP43 citations91
US6974525B2Dec 13, 2005
Method and apparatus for electrochemical planarization of a workpiece
SPEEDFAM IPEC CORP7 citations73
US6818604B2Nov 16, 2004
System and method for cleaning workpieces
SPEEDFAM IPEC CORP3 citations58
US6849547B2Feb 1, 2005
Apparatus and process for polishing a workpiece
SPEEDFAM IPEC CORP1 citations52
APPLIED MATERIALS INC
7 patentsUS9496145B2Nov 15, 2016
Electrochemical plating methods
APPLIED MATERIALS INC3 citations71
US11024537B2Jun 1, 2021
Methods and apparatus for hybrid feature metallization
APPLIED MATERIALS INC0 citations62
US11118278B2Sep 14, 2021
Enhanced plating bath and additive chemistries for cobalt plating
APPLIED MATERIALS INC0 citations59
US10487410B2Nov 26, 2019
Enhanced plating bath and additive chemistries for cobalt plating
APPLIED MATERIALS INC1 citations59
US10950500B2Mar 16, 2021
Methods and apparatus for filling a feature disposed in a substrate
APPLIED MATERIALS INC0 citations51
US10636655B2Apr 28, 2020
Methods for asymmetric deposition of metal on high aspect ratio nanostructures
APPLIED MATERIALS INC0 citations51
US9704717B2Jul 11, 2017
Electrochemical plating methods
APPLIED MATERIALS INC0 citations50