Inventor
WANG JONES
TW8 patents
⚠️ This page may combine multiple inventors who share the name “WANG JONES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
7 patentsUS6656827B1Dec 2, 2003
Electrical performance enhanced wafer level chip scale package with ground
TAIWAN SEMICONDUCTOR MFG142 citations98
US6939789B2Sep 6, 2005
Method of wafer level chip scale packaging
TAIWAN SEMICONDUCTOR MFG84 citations97
US7015066B2Mar 21, 2006
Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly
TAIWAN SEMICONDUCTOR MFG11 citations84
US6960518B1Nov 1, 2005
Buildup substrate pad pre-solder bump manufacturing
TAIWAN SEMICONDUCTOR MFG12 citations83
US6638837B1Oct 28, 2003
Method for protecting the front side of semiconductor wafers
TAIWAN SEMICONDUCTOR MFG12 citations73
US6884662B1Apr 26, 2005
Enhanced adhesion strength between mold resin and polyimide
TAIWAN SEMICONDUCTOR MFG2 citations62
US7390697B2Jun 24, 2008
Enhanced adhesion strength between mold resin and polyimide
TAIWAN SEMICONDUCTOR MFG0 citations51