Inventor
KARTA TJANDRA WINATA
TW16 patents
⚠️ This page may combine multiple inventors who share the name “KARTA TJANDRA WINATA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
9 patentsUS7863742B2Jan 4, 2011
Back end integrated WLCSP structure without aluminum pads
TAIWAN SEMICONDUCTOR MFG72 citations97
US7427803B2Sep 23, 2008
Electromagnetic shielding using through-silicon vias
TAIWAN SEMICONDUCTOR MFG84 citations97
US7838424B2Nov 23, 2010
Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching
TAIWAN SEMICONDUCTOR MFG84 citations96
US7656042B2Feb 2, 2010
Stratified underfill in an IC package
TAIWAN SEMICONDUCTOR MFG17 citations92
US7514775B2Apr 7, 2009
Stacked structures and methods of fabricating stacked structures
TAIWAN SEMICONDUCTOR MFG24 citations92
US7804177B2Sep 28, 2010
Silicon-based thin substrate and packaging schemes
TAIWAN SEMICONDUCTOR MFG31 citations91
US7846769B2Dec 7, 2010
Stratified underfill method for an IC package
TAIWAN SEMICONDUCTOR MFG3 citations63
US8049323B2Nov 1, 2011
Chip holder with wafer level redistribution layer
TAIWAN SEMICONDUCTOR MFG2 citations62
US7977155B2Jul 12, 2011
Wafer-level flip-chip assembly methods
TAIWAN SEMICONDUCTOR MFG1 citations51