Inventor
LEE MING-JER
TW8 patents
⚠️ This page may combine multiple inventors who share the name “LEE MING-JER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
4 patentsUS6291331B1Sep 18, 2001
Re-deposition high compressive stress PECVD oxide film after IMD CMP process to solve more than 5 metal stack via process IMD crack issue
TAIWAN SEMICONDUCTOR MFG111 citations96
US6372645B1Apr 16, 2002
Methods to reduce metal bridges and line shorts in integrated circuits
TAIWAN SEMICONDUCTOR MFG22 citations92
US6531382B1Mar 11, 2003
Use of a capping layer to reduce particle evolution during sputter pre-clean procedures
TAIWAN SEMICONDUCTOR MFG16 citations83
US6352924B1Mar 5, 2002
Rework method for wafers that trigger WCVD backside alarm
TAIWAN SEMICONDUCTOR MFG5 citations62