Inventor · disambiguated record
Jason E. Tripard
Also filed as: TRIPARD JASON E · TRIPARD JASON EDWARD
10 granted patents·175 citations·filing 1998–2017
88Inventor score
Top patents by PatentIndex Score
10 records- 0193US6277671B1Methods of forming integrated circuit packagesMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 21, 2001·136 cites·40 claims
- 0289US10890954B2Computing devices with formed edges and methods of manufacturing thereofMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2017·Granted Jan 12, 2021·17 cites·20 claims
- 0367US7367252B2Integrated circuit package separatorsMICRON TECHNOLOGY INC·Filed 2005·Granted May 6, 2008·3 cites·15 claims
- 0464US6508154B1Integrated circuit package separatorsMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 21, 2003·9 cites·21 claims
- 0558US7513182B2Integrated circuit package separatorsMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 7, 2009·1 cites·19 claims
- 0658US6718858B2Integrated circuit package separatorsMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 13, 2004·6 cites·25 claims
- 0748US6945151B1Integrated circuit package separatorsMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 20, 2005·3 cites·21 claims
- 0843US10698443B2Computing devices with an adhered cover and methods of manufacturing thereofMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2017·Granted Jun 30, 2020·0 cites·20 claims
- 0941US7276397B2Integrated circuit package separator methodsMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 2, 2007·0 cites·10 claims
- 1040US6920815B2Integrated circuit package separatorsMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 26, 2005·0 cites·8 claims
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