Inventor
SEOL JINKYEONG
KR6 patents
Patents
6 patentsUS11694996B2Jul 4, 2023
Semiconductor package including a pad contacting a via
SAMSUNG ELECTRONICS CO LTD2 citations71
US10510672B2Dec 17, 2019
Semiconductor packages and methods of manufacturing same
SAMSUNG ELECTRONICS CO LTD6 citations71
US12132019B2Oct 29, 2024
Packaged multi-chip semiconductor devices and methods of fabricating same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11552033B2Jan 10, 2023
Packaged multi-chip semiconductor devices and methods of fabricating same
SAMSUNG ELECTRONICS CO LTD1 citations62
US11557574B2Jan 17, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11075189B2Jul 27, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59