Inventor

AHNE HELLMUT

DE61 patents

⚠️ This page may combine multiple inventors who share the name “AHNE HELLMUT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AHNE HELLMUT

SIEMENS AG

Method for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after development

Heat resistant positive resists containing polyoxazoles

Highly heat-resistant positive resists comprising end-capped hydroxypolyamides

Photostructuring process

Etch-resistant deep ultraviolet resist process having an aromatic treating step after development

Heat resistant positive resists and method for preparing heat-resistant relief structures

Method for the preparation of heat-resistant relief structures using positive resists

Photostructuring method

Method for manufacturing polyoxazole and polythiazole precursors

Connection and build-up technique for multichip modules

Photosensitive mixture

Method for manufacturing highly heat-resistant dielectrics

Radiation-reactive precursor stages of highly heat-resistant polymers

Preparation of poly-o-hydroxyamides and poly o-mercaptoamides

Preparation of poly-o-hydroxyamides and poly o-mercaptoamides

N-Azidosulfonylaryl-maleinimides

Method for the preparation of highly heat-resistant relief structures and the use thereof

Method for the preparation of relief structures by phototechniques

Synthesis of polybenzoxasole and polybenzothiazole precursors

Method for manufacturing heat-stable structured layers based on expoxy resin

Preparation of poly-O-hydroxyamides and poly O-mercaptoamides

Preparation of poly-o-hydroxyamides and poly o-mercaptoamides

Method for the manufacture of polyimidazole and polyimidazo-pyrrolone precursors from tetra carboxylic acid moiety reactant

Method for the manufacture of polyimidazole and polyimidazopyrrolone precursors

Method for the preparation of polyimide and polyisoindoloquinazoline dione precursors

Method for producing orientation layers for liquid crystal displays and liquid crystal displays having orientation layers

Method and manufacturing polyimidazole and polyimidazopyrrolone relief structures

Preparation of polyimide and polyisoindoloquinazoline dione relief structures

Method for the preparation of thin polyimide film

Method for the preparation of orientation layers for liquid crystal displays and liquid crystal displays having orientation layers

Polyimidazole and polyimidazopyrrolone precursor stages and the preparation thereof

Polyimide, polyisoindoloquinazoline dione, polyoxazine dione and polyquinazoline dione precursor stages and the manufacture

Method for the preparation of highly heat-resistant relief structures and the use thereof

Method for the manufacture of highly heat-resistant relief structures

Method for the preparation of relief structures by phototechniques

Mixed polymers

Production of photolithographic structures

Method for producing a resist structure

Method for producing a resist structure

Capacitive moisture-sensor

Method for manufacturing heat-stable structured layers from photopolymers which are addition reaction products of olefinic unsaturated monoisocyanates and phenol-formaldehyde resins

Method for the production of heat-resistant structured layers

Polyether-based photopolymers

Preparation of poly-o-hydroxyamides and poly-o-mercaptoamides

Method of dry development utilizing quinone diazide and basic polymer resist with latent image intensification through treatment with silicon-organic compound in water

Preparing highly thermoresistant relief structures

Polyoxazole precursor and the preparation thereof

Method for the preparation of highly heat-resistant relief

Method for the production of poly-o-hydroxyamides

SIEMENS AKTINEGESELLSCHAFT

Photoresists which are suitable for producing sub-micron size structures