Inventor
STROM WILLIAM M
US7 patents
⚠️ This page may combine multiple inventors who share the name “STROM WILLIAM M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
4 patentsUS5886396AMar 23, 1999
Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package
MOTOROLA INC18 citations79
US5589402ADec 31, 1996
Process for manufacturing a package for mating with a bare semiconductor die
MOTOROLA INC12 citations71
US5587883ADec 24, 1996
Lead frame assembly for surface mount integrated circuit power package
MOTOROLA INC11 citations71
US5587605ADec 24, 1996
Package for mating with a semiconductor die
MOTOROLA INC14 citations71