Inventor
FUJIMOTO DAISUKE
JP19 patents
⚠️ This page may combine multiple inventors who share the name “FUJIMOTO DAISUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
11 patentsUS6667107B2Dec 23, 2003
Thermosetting resin composition and use thereof
HITACHI CHEMICAL CO LTD18 citations92
US6197149B1Mar 6, 2001
Production of insulating varnishes and multilayer printed circuit boards using these varnishes
HITACHI CHEMICAL CO LTD15 citations84
US7157506B2Jan 2, 2007
Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate
HITACHI CHEMICAL CO LTD7 citations73
US9661763B2May 23, 2017
Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
HITACHI CHEMICAL CO LTD4 citations68
US11049825B2Jun 29, 2021
Method for producing semiconductor device
HITACHI CHEMICAL CO LTD0 citations62
US7816430B2Oct 19, 2010
Composition of polycyanate ester and biphenyl epoxy resin
HITACHI CHEMICAL CO LTD3 citations61
US7078106B2Jul 18, 2006
Thermosetting resin composition and use thereof
HITACHI CHEMICAL CO LTD1 citations51
US11795293B2Oct 24, 2023
Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device
HITACHI CHEMICAL CO LTD0 citations48
US12256490B2Mar 18, 2025
Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package
HITACHI CHEMICAL CO LTD0 citations47
US10034384B2Jul 24, 2018
Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
HITACHI CHEMICAL CO LTD0 citations47
US9873771B2Jan 23, 2018
Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
HITACHI CHEMICAL CO LTD1 citations47
MIZUNO YASUYUKI
3 patentsUS8568891B2Oct 29, 2013
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
MIZUNO YASUYUKI3 citations58
US8277948B2Oct 2, 2012
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
MIZUNO YASUYUKI3 citations58
US8501870B2Aug 6, 2013
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
MIZUNO YASUYUKI0 citations48