Inventor
YANG JOUNGIN
KR17 patents
⚠️ This page may combine multiple inventors who share the name “YANG JOUNGIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
9 patentsUS7312519B2Dec 25, 2007
Stacked integrated circuit package-in-package system
STATS CHIPPAC LTD50 citations96
US8035210B2Oct 11, 2011
Integrated circuit package system with interposer
STATS CHIPPAC LTD27 citations92
US7482203B2Jan 27, 2009
Stacked integrated circuit package-in-package system
STATS CHIPPAC LTD18 citations92
US7298037B2Nov 20, 2007
Stacked integrated circuit package-in-package system with recessed spacer
STATS CHIPPAC LTD27 citations92
US7901987B2Mar 8, 2011
Package-on-package system with internal stacking module interposer
STATS CHIPPAC LTD19 citations91
US7986048B2Jul 26, 2011
Package-on-package system with through vias and method of manufacture thereof
STATS CHIPPAC LTD7 citations83
US7800211B2Sep 21, 2010
Stackable package by using internal stacking modules
STATS CHIPPAC LTD8 citations81
US9245772B2Jan 26, 2016
Stackable package by using internal stacking modules
STATS CHIPPAC LTD4 citations70
US7804166B2Sep 28, 2010
Integrated circuit package system with stacking module
STATS CHIPPAC LTD0 citations48
CHOI DAESIK
3 patentsUS9281228B2Mar 8, 2016
Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die
CHOI DAESIK7 citations82
US8710640B2Apr 29, 2014
Integrated circuit packaging system with heat slug and method of manufacture thereof
CHOI DAESIK5 citations71
US9406579B2Aug 2, 2016
Semiconductor device and method of controlling warpage in semiconductor package
CHOI DAESIK5 citations70