Inventor
TAMURA MUNEO
JP11 patents
⚠️ This page may combine multiple inventors who share the name “TAMURA MUNEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
8 patentsUS7550367B2Jun 23, 2009
Method for separating semiconductor substrate
DENSO CORP29 citations91
US7901967B2Mar 8, 2011
Dicing method for semiconductor substrate
DENSO CORP20 citations90
US7968432B2Jun 28, 2011
Laser processing apparatus and laser processing method
DENSO CORP12 citations84
US7838331B2Nov 23, 2010
Method for dicing semiconductor substrate
DENSO CORP16 citations84
US7498238B2Mar 3, 2009
Chip and method for dicing wafer into chips
DENSO CORP12 citations83
US7598118B2Oct 6, 2009
Method of manufacturing semiconductor sensor
DENSO CORP7 citations73
US7662668B2Feb 16, 2010
Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate
DENSO CORP3 citations62
US7763526B2Jul 27, 2010
Wafer and wafer cutting and dividing method
DENSO CORP6 citations54
NIPPON DENSO CO
2 patentsUS5877095AMar 2, 1999
Method of fabricating a semiconductor device having a silicon nitride film made of silane, ammonia and nitrogen
NIPPON DENSO CO577 citations98
US5592004AJan 7, 1997
Silicon nitride film having a short absorption wavelength and surrounding crystal-like grain boundaries
NIPPON DENSO CO16 citations80