Inventor

CHUN HYUNSUK

US28 patents

⚠️ This page may combine multiple inventors who share the name “CHUN HYUNSUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUN HYUNSUK

MICRON TECHNOLOGY INC

Methods for making double-sided semiconductor devices and related devices, assemblies, packages and systems

Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices

Semiconductor devices having crack-inhibiting structures

Semiconductor device assemblies and systems with improved thermal performance and methods for making the same

Semiconductor devices having crack-inhibiting structures

Semiconductor devices having crack-inhibiting structures

Thermal management of GPU-HBM package by microchannel integrated substrate

Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same

Thermal management of circuit boards

Semiconductor device assemblies and systems with improved thermal performance and methods for making the same

Thermal management of GPU-HBM package by microchannel integrated substrate

Semiconductor devices having crack-inhibiting structures

Semiconductor devices having crack-inhibiting structures

Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same

Thermal management of circuit boards

Two-step solder-mask-defined design

Heat spreaders for use in semiconductor device testing, such as burn-in testing

Heat spreaders for semiconductor devices, and associated systems and methods

Semiconductor device

Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods

Kits for enhanced cooling of components of computing devices and related computing devices, systems and methods

Semiconductor interconnect structures with narrowed portions, and associated systems and methods

Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods

SAMSUNG ELECTRONICS CO LTD

Semiconductor package having magnetic connection member

Semiconductor package

Semiconductor package and method of manufacturing the same

CHUN HYUNSUK

Semiconductor devices

LODESTAR LICENSING GROUP LLC

Two-step solder-mask-defined design