Inventor
ARIFEEN SHAMS U
US27 patents
Patents
27 patentsUS11011449B1May 18, 2021
Apparatus and method for dissipating heat in multiple semiconductor device modules
MICRON TECHNOLOGY INC8 citations83
US11984440B2May 14, 2024
Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods
MICRON TECHNOLOGY INC2 citations72
US11587918B2Feb 21, 2023
Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods
MICRON TECHNOLOGY INC2 citations72
US11444037B2Sep 13, 2022
Semiconductor devices having crack-inhibiting structures
MICRON TECHNOLOGY INC2 citations72
US11164837B1Nov 2, 2021
Semiconductor device packages with angled pillars for decreasing stress
MICRON TECHNOLOGY INC5 citations72
US10811365B2Oct 20, 2020
Semiconductor devices having crack-inhibiting structures
MICRON TECHNOLOGY INC3 citations72
US10784212B2Sep 22, 2020
Semiconductor devices having crack-inhibiting structures
MICRON TECHNOLOGY INC3 citations72
US11276659B2Mar 15, 2022
Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements
MICRON TECHNOLOGY INC4 citations71
US12211814B2Jan 28, 2025
Semiconductor interconnect structures with conductive elements, and associated systems and methods
MICRON TECHNOLOGY INC0 citations62
US11848282B2Dec 19, 2023
Semiconductor devices having crack-inhibiting structures
MICRON TECHNOLOGY INC0 citations62
US11728307B2Aug 15, 2023
Semiconductor interconnect structures with conductive elements, and associated systems and methods
MICRON TECHNOLOGY INC0 citations62
US11721658B2Aug 8, 2023
Semiconductor device packages with angled pillars for decreasing stress
MICRON TECHNOLOGY INC0 citations62
US11616028B2Mar 28, 2023
Semiconductor devices having crack-inhibiting structures
MICRON TECHNOLOGY INC0 citations62
US11239133B2Feb 1, 2022
Apparatus and method for dissipating heat in multiple semiconductor device modules
MICRON TECHNOLOGY INC1 citations62
US12218079B2Feb 4, 2025
Semiconductor devices with reinforced substrates
MICRON TECHNOLOGY INC0 citations61
US12211822B2Jan 28, 2025
Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods
MICRON TECHNOLOGY INC0 citations61
US11869862B2Jan 9, 2024
Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems
MICRON TECHNOLOGY INC0 citations61
US11855002B2Dec 26, 2023
Warpage control in microelectronic packages, and related assemblies and methods
MICRON TECHNOLOGY INC0 citations61
US11769752B2Sep 26, 2023
Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods
MICRON TECHNOLOGY INC0 citations61
US11552029B2Jan 10, 2023
Semiconductor devices with reinforced substrates
MICRON TECHNOLOGY INC0 citations61
US11031353B2Jun 8, 2021
Warpage control in microelectronic packages, and related assemblies and methods
MICRON TECHNOLOGY INC0 citations61
US12532775B2Jan 20, 2026
Methods and assemblies for measurement and prediction of package and die strength
MICRON TECHNOLOGY INC0 citations60
US11688658B2Jun 27, 2023
Semiconductor device
MICRON TECHNOLOGY INC0 citations59
US12341110B2Jun 24, 2025
Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices
MICRON TECHNOLOGY INC0 citations51
US11664360B2May 30, 2023
Circuit board with spaces for embedding components
MICRON TECHNOLOGY INC0 citations51
US11646286B2May 9, 2023
Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints
MICRON TECHNOLOGY INC0 citations51
US11997782B2May 28, 2024
Thermally conductive label for circuit
MICRON TECHNOLOGY INC0 citations40