Inventor

YANO HIROYUKI

JP152 patents

⚠️ This page may combine multiple inventors who share the name “YANO HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANO HIROYUKI

TOSHIBA KK

Apparatus for processing semiconductor wafers

Method of manufacturing semiconductor device

Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded writing

Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device

Chemical mechanical method of polishing wafer surfaces

Polishing method and polishing apparatus

Polishing method and polishing apparatus

Pad condition and polishing rate monitor using fluorescence

Semiconductor wafer having identification indication and method of manufacturing the same

Polishing apparatus and method for planarizing layer on a semiconductor wafer

Polishing apparatus and method for planarizing layer on a semiconductor wafer

Method of forming a shallow trench isolation structure

Method of manufacturing semiconductor device

Semiconductor planarizing apparatus

Method for planarizing a semiconductor device having a amorphous layer

Method of manufacturing semiconductor device

Method and apparatus for polishing a workpiece

Method of manufacturing semiconductor device

Slurry for CMP, polishing method and method of manufacturing semiconductor device

Manufacturing method of semiconductor device

Post-CMP treating liquid and method for manufacturing semiconductor device

Slurry for CMP, and method of manufacturing semiconductor device

Semiconductor device having a damascene type wiring layer

Method for monitoring the shape of the processed surfaces of semiconductor devices and equipment for manufacturing the semiconductor devices

Conditioner for a polishing tool

Method of manufacturing semiconductor device

Apparatus for processing semiconductor wafers

Method of manufacturing semiconductor device

Method of processing a substrate

Polishing apparatus and method

Semiconductor device containing a dummy wire

Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method

Semiconductor device having an improved construction in the interlayer insulating film

Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process

Method of manufacturing semiconductor device

Polishing apparatus

Apparatus for polishing a wafer

DAIO SEISHI KK

Absorbent article

Absorber and absorbent article

Manufacturing facility of absorbent body, absorbent body and absorbent article

KUMIAI CHEMICAL INDUSTRY CO

Bacillus sp. D747 strain, plant disease controlling agents and insect pest controlling agents using the same and control method using the agents

3-arylphenyl sulfide derivative and insecticide and miticide

EBARA CORP

Method for polishing a substrate

Polishing apparatus and method

KABUSHKI KAISHA TOSHIBA

Method of manufacturing semiconductor device

SUMITOMO RUBBER IND

Vulcanized rubber composition, pneumatic tire and the process of producing the same

JSR CORP

Slurry for chemical mechanical polishing and method of manufacturing semiconductor device

ASAHI CHEMICAL IND

Process for producing an oxide catalyst for oxidation or ammoxidation

AISIN SEIKI

Sun-roof device

MITSUBISHI ELECTRIC CORP

Cooling fan with reduced noise capability in an ac generator