Inventor
HSIAO HSIEN-LUNG
TW5 patents
Patents
5 patentsUS11728178B2Aug 15, 2023
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations69
US12394636B2Aug 19, 2025
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12033868B2Jul 9, 2024
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US10903088B2Jan 26, 2021
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US11239125B2Feb 1, 2022
Carrier structure and package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations57