Inventor
CHENG KAUN-I
TW8 patents
⚠️ This page may combine multiple inventors who share the name “CHENG KAUN-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
7 patentsUS11728178B2Aug 15, 2023
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations69
US10396040B2Aug 27, 2019
Method for fabricating electronic package having a protruding barrier frame
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations67
US9997469B2Jun 12, 2018
Electronic package having a protruding barrier frame
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations67
US10950520B2Mar 16, 2021
Electronic package, method for fabricating the same, and heat dissipator
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations60
US12394636B2Aug 19, 2025
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12033868B2Jul 9, 2024
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US10903088B2Jan 26, 2021
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59