Inventor
JAN SEN-BOR
TW46 patents
⚠️ This page may combine multiple inventors who share the name “JAN SEN-BOR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
40 patentsUS10312201B1Jun 4, 2019
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations93
US11107779B2Aug 31, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11094613B2Aug 17, 2021
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10510701B2Dec 17, 2019
Semiconductor die connection system and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9520340B2Dec 13, 2016
Semiconductor die connection system and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10741506B2Aug 11, 2020
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US11728247B2Aug 15, 2023
Manufacturing method of semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12223250B2Feb 11, 2025
Method of manufacturing integrated circuit having through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11735536B2Aug 22, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11387205B2Jul 12, 2022
Semiconductor die connection system and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11342297B2May 24, 2022
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11309243B2Apr 19, 2022
Package having different metal densities in different regions and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10930580B2Feb 23, 2021
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10784219B2Sep 22, 2020
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10515874B2Dec 24, 2019
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11482499B2Oct 25, 2022
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11410929B2Aug 9, 2022
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10504776B2Dec 10, 2019
Methods for forming through-substrate vias penetrating inter-layer dielectric
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11748544B2Sep 5, 2023
Method of manufacturing integrated circuit having through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11080455B1Aug 3, 2021
Layout design of integrated circuit with through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US12362261B2Jul 15, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12218093B2Feb 4, 2025
Semiconductor die connection system and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12165971B2Dec 10, 2024
Package having different metal densities in different regions and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12113036B2Oct 8, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12080629B2Sep 3, 2024
Manufacturing method of semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12074131B2Aug 27, 2024
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11855029B2Dec 26, 2023
Semiconductor die connection system and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11791243B2Oct 17, 2023
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11769724B2Sep 26, 2023
Package having different metal densities in different regions and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11462458B2Oct 4, 2022
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12476206B2Nov 18, 2025
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12223252B2Feb 11, 2025
Through-silicon via in integrated circuit packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12124078B2Oct 22, 2024
Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11916031B2Feb 27, 2024
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11756901B2Sep 12, 2023
Seal ring for hybrid-bond
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11586797B2Feb 21, 2023
Through-silicon vias in integrated circuit packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11335656B2May 17, 2022
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10949597B2Mar 16, 2021
Through-silicon vias in integrated circuit packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11923302B2Mar 5, 2024
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10049965B2Aug 14, 2018
Through-substrate vias and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51