Inventor
HU YONGJUN
US34 patents
⚠️ This page may combine multiple inventors who share the name “HU YONGJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
31 patentsUS5633200AMay 27, 1997
Process for manufacturing a large grain tungsten nitride film and process for manufacturing a lightly nitrided titanium salicide diffusion barrier with a large grain tungsten nitride cover layer
MICRON TECHNOLOGY INC164 citations99
US6436818B1Aug 20, 2002
Semiconductor structure having a doped conductive layer
MICRON TECHNOLOGY INC114 citations98
US6015997AJan 18, 2000
Semiconductor structure having a doped conductive layer
MICRON TECHNOLOGY INC87 citations98
US6614085B2Sep 2, 2003
Antireflective coating layer
MICRON TECHNOLOGY INC47 citations96
US6096640AAug 1, 2000
Method of making a gate electrode stack with a diffusion barrier
MICRON TECHNOLOGY INC51 citations96
US5962904AOct 5, 1999
Gate electrode stack with diffusion barrier
MICRON TECHNOLOGY INC53 citations96
US5725739AMar 10, 1998
Low angle, low energy physical vapor deposition of alloys
MICRON TECHNOLOGY INC82 citations96
US6262458B1Jul 17, 2001
Low resistivity titanium silicide structures
MICRON TECHNOLOGY INC22 citations92
US5926730AJul 20, 1999
Conductor layer nitridation
MICRON TECHNOLOGY INC30 citations92
US5863393AJan 26, 1999
Low angle, low energy physical vapor deposition of alloys
MICRON TECHNOLOGY INC21 citations92
US6680246B2Jan 20, 2004
Process for forming a nitride film
MICRON TECHNOLOGY INC11 citations82
US6204171B1Mar 20, 2001
Process for forming a film composed of a nitride of a diffusion barrier material
MICRON TECHNOLOGY INC12 citations82
US6887774B2May 3, 2005
Conductor layer nitridation
MICRON TECHNOLOGY INC8 citations74
US6806573B2Oct 19, 2004
Low angle, low energy physical vapor deposition of alloys
MICRON TECHNOLOGY INC6 citations74
US6798026B2Sep 28, 2004
Conductor layer nitridation
MICRON TECHNOLOGY INC10 citations74
US6753584B1Jun 22, 2004
Antireflective coating layer
MICRON TECHNOLOGY INC11 citations74
US6525384B2Feb 25, 2003
Conductor layer nitridation
MICRON TECHNOLOGY INC7 citations74
US6445045B2Sep 3, 2002
Low resistivity titanium silicide structures
MICRON TECHNOLOGY INC5 citations74
US6417104B1Jul 9, 2002
Method for making a low resistivity electrode having a near noble metal
MICRON TECHNOLOGY INC5 citations74
US6214711B1Apr 10, 2001
Method of low angle, low energy physical vapor of alloys including redepositing layers of different compositions in trenches
MICRON TECHNOLOGY INC11 citations74
US6004869ADec 21, 1999
Method for making a low resistivity electrode having a near noble metal
MICRON TECHNOLOGY INC7 citations74
US6689685B2Feb 10, 2004
Process for forming a diffusion barrier material nitride film
MICRON TECHNOLOGY INC2 citations63
US6627389B1Sep 30, 2003
Photolithography method using an antireflective coating
MICRON TECHNOLOGY INC2 citations63
US6444579B1Sep 3, 2002
Methods of forming low resistivity titanium silicide structures
MICRON TECHNOLOGY INC3 citations63
US6127270AOct 3, 2000
Methods of forming refractory metal silicide components and methods of restricting silicon surface migration of a silicon structure
MICRON TECHNOLOGY INC2 citations63
US7105997B1Sep 12, 2006
Field emitter devices with emitters having implanted layer
MICRON TECHNOLOGY INC0 citations52
US6998341B2Feb 14, 2006
Process for forming a diffusion barrier material nitride film
MICRON TECHNOLOGY INC0 citations52
US6953749B2Oct 11, 2005
Methods of forming refractory metal silicide components and methods of restricting silicon surface migration of a silicon structure
MICRON TECHNOLOGY INC0 citations52
US6479381B2Nov 12, 2002
Process for forming a diffusion-barrier-material nitride film
MICRON TECHNOLOGY INC0 citations52
US6468905B1Oct 22, 2002
Methods of restricting silicon migration
MICRON TECHNOLOGY INC0 citations52
US6120915ASep 19, 2000
Methods of forming refractory metal silicide components and methods of restricting silicon surface migration of a silicon structure
MICRON TECHNOLOGY INC0 citations52