Inventor

LEE CHIH CHENG

TW112 patents

⚠️ This page may combine multiple inventors who share the name “LEE CHIH CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE CHIH CHENG

ADVANCED SEMICONDUCTOR ENG

Embedded component package structure and method of manufacturing the same

Semiconductor substrate, semiconductor module and method for manufacturing the same

Substrate, semiconductor device package and method of manufacturing the same

Semiconductor package structure and semiconductor process

Semiconductor substrate, semiconductor module and method for manufacturing the same

Double plated conductive pillar package substrate

Semiconductor device and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Electrical connection placement of semiconductor device package and method of manufacturing the same

Antenna package and method of manufacturing the same

Semiconductor package and semiconductor manufacturing process

Semiconductor substrate mitigating bridging

Double side via last method for double embedded patterned substrate

Substrate, semiconductor package structure and manufacturing process

Substrate, semiconductor package structure and manufacturing process

Substrate, semiconductor package including the same, and method for manufacturing the same

Double side via last method for double embedded patterned substrate

Semiconductor device package and method for manufacturing the same

Embedded component package structure and manufacturing method thereof

Substrate having a conductive structure within photo-sensitive resin

Semiconductor substrate and semiconductor packaging device, and method for forming the same

Semiconductor substrate, semiconductor module and method for manufacturing the same

Circuit board with embedded passive component and manufacturing method thereof

Package substrate, electronic device package and method for manufacturing the same

Semiconductor device package with stress buffering layer and method for manufacturing the same

Reduced-dimension via-land structure and method of making the same

Semiconductor packages

Semiconductor device package, electronic assembly and method for manufacturing the same

Semiconductor device package having a core substrate and an embedded component in the core substrate

Semiconductor device package and method of manufacturing the same

Semiconductor device package, electronic assembly and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Substrate, semiconductor device package and method of manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor device, semiconductor device package and method of manufacturing the same

Semiconductor device package, electronic assembly and method for manufacturing the same

Embedded component package structure having a magnetically permeable layer

Semiconductor substrate and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method for manufacturing the same

Substrate structure having pad portions

Substrate, semiconductor device package and method of manufacturing the same

E GLUCK CORP

Watch case

Watch case

SUNREX TECHNOLOGY CORP

Touchpad device and operation method of the same

Touchpad device and operation method of the same

FUTAIJING PREC ELECTRONICS YANTAI CO LTD

Energy absorbing structure for vehicle-mounted display screen and display screen using the same

Rocking arm structure providing additional wheel support and device having the same

CHI MEI CORP

Modified high cis conjugated diene copolymer and manufacturing method of the same