Inventor
ALBERMANN GUIDO
DE11 patents
⚠️ This page may combine multiple inventors who share the name “ALBERMANN GUIDO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP BV
10 patentsUS9847258B2Dec 19, 2017
Plasma dicing with blade saw patterned underside mask
NXP BV16 citations81
US9601437B2Mar 21, 2017
Plasma etching and stealth dicing laser process
NXP BV7 citations81
US8809166B2Aug 19, 2014
High die strength semiconductor wafer processing method and system
NXP BV9 citations81
US10896878B2Jan 19, 2021
Integrated circuit saw bow break point
NXP BV0 citations60
US11881425B2Jan 23, 2024
Technique for handling diced wafers of integrated circuits
NXP BV0 citations59
US11508606B2Nov 22, 2022
Technique for handling diced wafers of integrated circuits
NXP BV0 citations59
US8895363B2Nov 25, 2014
Die preparation for wafer-level chip scale package (WLCSP)
NXP BV3 citations58
US9812361B2Nov 7, 2017
Combination grinding after laser (GAL) and laser on-off function to increase die strength
NXP BV1 citations49
US9349645B2May 24, 2016
Apparatus, device and method for wafer dicing
NXP BV0 citations48
US10347534B2Jul 9, 2019
Variable stealth laser dicing process
NXP BV0 citations38