Inventor
YANG NIAN-CIH
TW3 patents
Patents
3 patentsUS11056555B2Jul 6, 2021
Semiconductor device having 3D inductor and method of manufacturing the same
CHIPBOND TECHNOLOGY CORP0 citations43
US10808331B2Oct 20, 2020
Electroplating system and pressure device thereof
CHIPBOND TECHNOLOGY CORP0 citations29
US10168582B1Jan 1, 2019
Chip package having a flexible substrate
CHIPBOND TECHNOLOGY CORP0 citations23