Inventor
KANG HYUCK-JIN
KR4 patents
Patents
4 patentsUS6984895B2Jan 10, 2006
Bonding pad structure of a semiconductor device
SAMSUNG ELECTRONICS CO LTD15 citations82
US7180154B2Feb 20, 2007
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD15 citations77
US6867070B2Mar 15, 2005
Bonding pad structure of a semiconductor device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations60
US7352050B2Apr 1, 2008
Fuse region of a semiconductor region
SAMSUNG ELECTRONICS CO LTD0 citations44