Inventor
WANG YEN-KUN V
US3 patents
Patents
3 patentsUS7335609B2Feb 26, 2008
Gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materials
APPLIED MATERIALS INC70 citations95
US7456116B2Nov 25, 2008
Gap-fill depositions in the formation of silicon containing dielectric materials
APPLIED MATERIALS INC42 citations90
US7204888B2Apr 17, 2007
Lift pin assembly for substrate processing
APPLIED MATERIALS INC22 citations89