Inventor

HUANG CHUN-AN

TW7 patents

⚠️ This page may combine multiple inventors who share the name “HUANG CHUN-AN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHAN CHANG-YUEH

2 patents

US8198689B2Jun 12, 2012

Package structure having micro-electromechanical element and fabrication method thereof

CHAN CHANG-YUEH2 citations60

US8564115B2Oct 22, 2013

Package structure having micro-electromechanical element

CHAN CHANG-YUEH0 citations50

HUANG CHUN-AN

2 patents

US8610272B2Dec 17, 2013

Package structure with micro-electromechanical element and manufacturing method thereof

HUANG CHUN-AN4 citations58

US8288189B2Oct 16, 2012

Package structure having MEMS element and fabrication method thereof

HUANG CHUN-AN0 citations37

SILICONWARE PRECISION INDUSTRIES CO LTD

2 patents

US9487393B2Nov 8, 2016

Fabrication method of wafer level package having a pressure sensor

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51

US8741693B2Jun 3, 2014

Method for manufacturing package structure with micro-electromechanical element

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51

CHANG HONG-DA

1 patent

US9133021B2Sep 15, 2015

Wafer level package having a pressure sensor and fabrication method thereof

CHANG HONG-DA9 citations81