Inventor
PENG YU-YUN
TW71 patents
⚠️ This page may combine multiple inventors who share the name “PENG YU-YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
45 patentsUS9754818B2Sep 5, 2017
Via patterning using multiple photo multiple etch
TAIWAN SEMICONDUCTOR MFG CO LTD472 citations98
US10950731B1Mar 16, 2021
Inner spacers for gate-all-around semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD25 citations94
US9659811B1May 23, 2017
Manufacturing method of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations92
US9412648B1Aug 9, 2016
Via patterning using multiple photo multiple etch
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations92
US11158539B2Oct 26, 2021
Method and structure for barrier-less plug
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10535512B2Jan 14, 2020
Formation method of semiconductor device with gate spacer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US11855214B2Dec 26, 2023
Inner spacers for gate-all-around semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11373866B2Jun 28, 2022
Dielectric material and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11227794B2Jan 18, 2022
Method for making self-aligned barrier for metal vias In-Situ during a metal halide pre-clean and associated interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10971391B2Apr 6, 2021
Dielectric gap fill
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10879111B1Dec 29, 2020
Dielectric plugs
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10510895B2Dec 17, 2019
Device and method of dielectric layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510584B2Dec 17, 2019
Via patterning using multiple photo multiple etch
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10340178B2Jul 2, 2019
Via patterning using multiple photo multiple etch
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11393677B2Jul 19, 2022
Semiconductor device structure with gate spacer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10867785B2Dec 15, 2020
Structure and formation method of semiconductor device with gate spacer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11942358B2Mar 26, 2024
Low thermal budget dielectric for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10669625B2Jun 2, 2020
Pumping liner for chemical vapor deposition
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10991636B2Apr 27, 2021
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US10957585B2Mar 23, 2021
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations65
US12034075B2Jul 9, 2024
Device of dielectric layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11996363B2May 28, 2024
Interconnect structure including a heat dissipation layer and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11935752B2Mar 19, 2024
Device of dielectric layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11018258B2May 25, 2021
Device of dielectric layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10957543B2Mar 23, 2021
Device and method of dielectric layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12512317B2Dec 30, 2025
Dielectric material and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12341013B2Jun 24, 2025
Method and structure for barrier-less plug
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12336214B2Jun 17, 2025
Inner spacers for gate-all-around semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12315837B2May 27, 2025
Storage layers for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255239B2Mar 18, 2025
Liner layer for backside contacts of semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255249B2Mar 18, 2025
Inner spacer structures for gate-all-around field effect transistors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051592B2Jul 30, 2024
Method and structure for barrier-less plug
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11972974B2Apr 30, 2024
Self-aligned barrier for metal vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908921B2Feb 20, 2024
Transistor isolation structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11817343B2Nov 14, 2023
Dielectric gap fill
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11804539B2Oct 31, 2023
Transistor isolation structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11488869B2Nov 1, 2022
Transistor isolation structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11282712B2Mar 22, 2022
Method for preventing bottom layer wrinkling in a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10141220B2Nov 27, 2018
Via patterning using multiple photo multiple etch
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12550720B2Feb 10, 2026
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12308312B2May 20, 2025
Interconnect structure and method for manufacturing the interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11854796B2Dec 26, 2023
Semiconductor device structure with gate spacer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11637062B2Apr 25, 2023
Interconnect structure and method for manufacturing the interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11257753B2Feb 22, 2022
Interconnect structure and method for manufacturing the interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12575123B2Mar 10, 2026
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
TAIWAN SEMICONDUCTOR MFG
2 patentsLIOU JOUNG-WEI
1 patentPENG YU-YUN
1 patentTAIWAN SEMICONDUCTOR MFG COMPANY LTD
1 patentShowing the top 50 of 71 patents by PatentIndex Score.