Inventor
BERNDLMAIER ERICH
US4 patents
Patents
4 patentsUS4323914AApr 6, 1982
Heat transfer structure for integrated circuit package
IBM287 citations95
US5059553AOct 22, 1991
Metal bump for a thermal compression bond and method for making same
IBM70 citations92
US4346343AAug 24, 1982
Power control means for eliminating circuit to circuit delay differences and providing a desired circuit delay
IBM29 citations91
US5053851AOct 1, 1991
Metal bump for a thermal compression bond and method for making same
IBM23 citations89